CRANT Talks Series: Building a Bridge in Metaverse: Challenges and Opportunities to Internet of Things

School of Science and Technology CRANT Talks Series: Building a Bridge in Metaverse: Challenges and Opportunities to Internet of Things

CRANT Talks Series: Building a Bridge in Metaverse: Challenges and Opportunities to Internet of Things

Speaker: Dr. Henry Hong-ning Dai (HKBU)
Organizer: CRANT, S&T
Date: 27 April 2023 (Thursday)
Time: 10:00 AM – 11:30 AM
Location: Jockey Club Council Chamber (A1216), Main Campus, HKMU


Building a Bridge in Metaverse: Challenges and Opportunities to Internet of Things


As one of the most popular buzzwords, the Metaverse is envisioned to revolutionize the Internet by immersing users into physical-virtual world interactions. The Internet of Things (IoT) serves as a key component to establish the connection between the physical world and the virtual world. However, intrinsic features of IoT result in challenges such as performance bottleneck, poor interoperability, privacy leakage risk, and security vulnerability. In this talk, I will first briefly review the Metaverse as well as relevant technologies. I will then elaborate on the key role of IoT in realizing the Metaverse. I will next summarize several challenges of IoT and present several potential solutions in tackling these challenges of IoT by integration of artificial intelligence (AI), edge computing, blockchain, and relevant technologies. Finally, I will discuss several future directions in this promising area.


Hong-Ning Dai is an Associate Professor in the Department of Computer Science, Hong Kong Baptist University (HKBU). He obtains a Ph.D. degree in Computer Science and Engineering from the Chinese University of Hong Kong. Before joining HKBU, he has more than 10-year academic experience in Lingnan University (Hong Kong), Macau University of Science and Technology, Hong Kong University of Science and Technology, the Chinese University of Hong Kong, Hong Kong Applied Science and Technology Research Institute, and the University of New South Wales University, Australia. His current research interests include Blockchain, the Internet of Things, and Big Data Analytics.

Dr. Dai has published more than 200 papers in referred journals and conferences including Proceedings of the IEEE, IEEE Journal on Selected Areas in Communications (JSAC), IEEE Transactions on Mobile Computing (TMC), IEEE Transactions on Parallel and Distributed Systems (TPDS), IEEE Transactions on Computer (TC), IEEE Transactions on Knowledge and Data Engineering (TKDE), IEEE Transactions on Wireless Communications (TWC), ACM/IEEE IEEE/ACM International Conference on Automated Software Engineering (ASE), IEEE Conference on Computer Communications (INFOCOM), AAAI Conference on Artificial Intelligence (AAAI), IEEE Transactions on Neural Networks and Learning Systems (TNNLS), ACM Computing Surveys (CSUR), IEEE Communications Surveys & Tutorials, etc. His publications have received more than 13,000 citations. He was also included in the world’s top 2% scientists for career-long impact by Stanford University, USA. He is the holder of 1 U.S. patent and 1 Australia innovation patent. He is the senior member of IEEE and ACM.

Dr. Dai has served as an associate editor for IEEE Communications Surveys & Tutorials, IEEE Transactions on Intelligent Transportation Systems, IEEE Transactions on Industrial Informatics, IEEE Transactions on Industrial Cyber-Physical Systems, Ad Hoc Networks (Elsevier), and Connection Science (Taylor & Francis).

Jonathan Chiu
Marketing Director
3DP Technology Limited

Jonathan handles all external affairs include business development, patents write up and public relations. He is frequently interviewed by media and is considered a pioneer in 3D printing products.

Krutz Cheuk
Biomedical Engineer
Hong Kong Sanatorium & Hospital

After graduating from OUHK, Krutz obtained an M.Sc. in Engineering Management from CityU. He is now completing his second master degree, M.Sc. in Biomedical Engineering, at CUHK. Krutz has a wide range of working experience. He has been with Siemens, VTech, and PCCW.

Hugo Leung
Software and Hardware Engineer
Innovation Team Company Limited

Hugo Leung Wai-yin, who graduated from his four-year programme in 2015, won the Best Paper Award for his ‘intelligent pill-dispenser’ design at the Institute of Electrical and Electronics Engineering’s International Conference on Consumer Electronics – China 2015.

The pill-dispenser alerts patients via sound and LED flashes to pre-set dosage and time intervals. Unlike units currently on the market, Hugo’s design connects to any mobile phone globally. In explaining how it works, he said: ‘There are three layers in the portable pillbox. The lowest level is a controller with various devices which can be connected to mobile phones in remote locations. Patients are alerted by a sound alarm and flashes. Should they fail to follow their prescribed regime, data can be sent via SMS to relatives and friends for follow up.’ The pill-dispenser has four medicine slots, plus a back-up with a LED alert, topped by a 500ml water bottle. It took Hugo three months of research and coding to complete his design, but he feels it was worth all his time and effort.

Hugo’s public examination results were disappointing and he was at a loss about his future before enrolling at the OUHK, which he now realizes was a major turning point in his life. He is grateful for the OUHK’s learning environment, its industry links and the positive guidance and encouragement from his teachers. The University is now exploring the commercial potential of his design with a pharmaceutical company. He hopes that this will benefit the elderly and chronically ill, as well as the society at large.

Soon after completing his studies, Hugo joined an automation technology company as an assistant engineer. He is responsible for the design and development of automation devices. The target is to minimize human labor and increase the quality of products. He is developing products which are used in various sections, including healthcare, manufacturing and consumer electronics.

Course Code Title Credits
  COMP S321F Advanced Database and Data Warehousing 5
  COMP S333F Advanced Programming and AI Algorithms 5
  COMP S351F Software Project Management 5
  COMP S362F Concurrent and Network Programming 5
  COMP S363F Distributed Systems and Parallel Computing 5
  COMP S382F Data Mining and Analytics 5
  COMP S390F Creative Programming for Games 5
  COMP S492F Machine Learning 5
  ELEC S305F Computer Networking 5
  ELEC S348F IOT Security 5
  ELEC S371F Digital Forensics 5
  ELEC S431F Blockchain Technologies 5
  ELEC S425F Computer and Network Security 5
 Course CodeTitleCredits
 ELEC S201FBasic Electronics5
 IT S290FHuman Computer Interaction & User Experience Design5
 STAT S251FStatistical Data Analysis5
 Course CodeTitleCredits
 COMPS333FAdvanced Programming and AI Algorithms5
 COMPS362FConcurrent and Network Programming5
 COMPS363FDistributed Systems and Parallel Computing5
 COMPS380FWeb Applications: Design and Development5
 COMPS381FServer-side Technologies and Cloud Computing5
 COMPS382FData Mining and Analytics5
 COMPS390FCreative Programming for Games5
 COMPS413FApplication Design and Development for Mobile Devices5
 COMPS492FMachine Learning5
 ELECS305FComputer Networking5
 ELECS363FAdvanced Computer Design5
 ELECS425FComputer and Network Security5